SubPc/C60 Bulk Heterojunction Interfaces Using Illuminated KPFM

dc.contributorArango, Alexi
dc.contributorVan Giessen, Alan
dc.contributor.advisorAidala, Katherine
dc.contributor.authorPhillips, Ella
dc.date.accessioned2025-08-21T15:02:00Z
dc.date.gradyear2025
dc.date.issued2025-08-21
dc.description.abstractThird generation solar cells are the future of energy collection and storage. Organic photovoltaics (OPVs) made of layers of organic semiconductors are what make up these solar cells, but the material interfaces are still not something that is fully understood. By doing Kelvin-probe force microscopy scans on the bulk heterojunction interface, we are able to understand more about energy conversion from photons to electricity and what materials allow for the highest efficiency. Creating an ‘open-faced’ solar cell by depositing a donor material, boron subphthalocyanine chloride (SubPc), and the acceptor material, buckminsterfullerene (C60), where then MoO3 collects holes that go into the ITO substrate, we are able to determine the photovoltage at the heterojunction. Using Kelvin probe force microscopy (KPFM), the interface can be studied to see the energy band offset of the two materials, calculating the potential difference. Our results show that these organic photovoltaics have a difference in potential of 20-30 mV between dark and illuminated scans.
dc.description.sponsorshipPhysics
dc.identifier.urihttps://hdl.handle.net/10166/6790
dc.language.isoen_US
dc.rights.restrictedpublic
dc.subjectKPFM
dc.subjectSolar Cell
dc.subjectSubPC
dc.subjectC60
dc.subjectBulk Heterojunction
dc.titleSubPc/C60 Bulk Heterojunction Interfaces Using Illuminated KPFM
dc.typeThesis
mhc.degreeUndergraduate
mhc.institutionMount Holyoke College

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
PhillipsThesis.pdf
Size:
30.05 MB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
2.13 KB
Format:
Item-specific license agreed upon to submission
Description: